US 12,266,852 B2
Electronic device
Chia-Ping Tseng, Miao-Li County (TW); Ker-Yih Kao, Miao-Li County (TW); Chia-Chi Ho, Miao-Li County (TW); Ming-Yen Weng, Miao-Li County (TW); Hung-I Tseng, Miao-Li County (TW); Shu-Ling Wu, Miao-Li County (TW); and Huei-Ying Chen, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Jan. 2, 2024, as Appl. No. 18/401,885.
Application 18/401,885 is a continuation of application No. 17/929,907, filed on Sep. 6, 2022, granted, now 11,901,618.
Application 17/929,907 is a continuation of application No. 16/732,701, filed on Jan. 2, 2020, granted, now 11,469,491, issued on Oct. 11, 2022.
Claims priority of provisional application 62/799,120, filed on Jan. 31, 2019.
Claims priority of application No. 201910848956.X (CN), filed on Sep. 9, 2019.
Prior Publication US 2024/0162602 A1, May 16, 2024
Int. Cl. H01Q 1/38 (2006.01); G02F 1/1343 (2006.01); H01L 21/04 (2006.01); H01L 27/12 (2006.01); H01Q 3/34 (2006.01); H01Q 3/44 (2006.01); H01Q 9/04 (2006.01); G02F 1/1333 (2006.01)
CPC H01Q 1/38 (2013.01) [G02F 1/13439 (2013.01); H01L 21/045 (2013.01); H01L 27/1237 (2013.01); H01Q 3/34 (2013.01); H01Q 3/44 (2013.01); H01Q 9/0407 (2013.01); G02F 1/133345 (2013.01); G02F 2201/07 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first substrate;
an insulating layer overlapped with the first substrate;
a first conductive layer; and
a second conductive layer contacting with the first conductive layer, wherein the first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer, and the second conductive layer is disposed between the first conductive layer and the insulating layer,
wherein a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer,
wherein the insulating layer comprises a first curved top corner, a first top surface and a first side surface, and the first curved top corner is connected between the first top surface and the first side surface.
 
13. An electronic device, comprising:
a first substrate;
an insulating layer overlapped with the first substrate;
a first conductive layer; and
a second conductive layer contacting with the first conductive layer, wherein the first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer, and the second conductive layer is disposed between the first conductive layer and the insulating layer,
wherein a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer,
wherein the first conductive layer comprises a first curved top corner.