US 12,266,846 B2
System packaging for millimeter wave antennas
Sidharth S. Dalmia, San Jose, CA (US); Wansuk Yun, Sunnyvale, CA (US); and Flynn P. Carson, Redwood City, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Sep. 2, 2021, as Appl. No. 17/465,761.
Prior Publication US 2023/0066814 A1, Mar. 2, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); H04B 1/00 (2006.01); H04W 52/02 (2009.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/246 (2013.01); H01Q 1/38 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/0087 (2013.01); H04B 1/0064 (2013.01); H04W 52/0206 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio frequency package, comprising:
a first portion of an antenna array module configured to provide a first wireless communication functionality;
a second portion of the antenna array module configured to provide a second wireless communication functionality; and
a flexible cable configured to communicate signals between the first portion of the antenna array module and the second portion of the antenna array module, the flexible cable comprising:
a first end;
a second end;
a first surface, wherein the first portion of the antenna array module is directly coupled to the first surface between the first end and the second end; and
a second surface, wherein the second portion of the antenna array module is directly coupled to the second surface between the first end and the second end.