US 12,266,742 B2
Semiconductor light emitting device and semiconductor light emitting device array
Myoungsun Ha, Suwon-si (KR); Hyunju Park, Hwaseong-si (KR); Sunwoo Kim, Hwaseong-si (KR); and Youngkyung Kim, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 20, 2022, as Appl. No. 17/724,758.
Claims priority of application No. 10-2021-0081340 (KR), filed on Jun. 23, 2021.
Prior Publication US 2022/0416130 A1, Dec. 29, 2022
Int. Cl. H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/486 (2013.01) [H01L 25/0753 (2013.01); H01L 33/502 (2013.01); H01L 33/62 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor light emitting device, comprising:
a package body including a concave portion, the concave portion being surrounded by sidewalls of the package body;
at least one light emitting diode (LED) chip on a mounting surface of the concave portion;
a lead frame in the package body, the lead frame being electrically connected to the at least one LED chip;
a wavelength conversion layer in the concave portion and surrounding the at least one LED chip, the wavelength conversion layer being surrounded by the sidewalls of the package body and including a wavelength conversion material; and
a transparent resin layer on the wavelength conversion layer to seal the wavelength conversion layer, the transparent resin layer having:
first opposite side surfaces exposed through sides of the package body, the first opposite side surfaces being spaced apart from each other along a first direction parallel to the mounting surface, and
second opposite side surfaces in contact with an inner surface of the package body, the second opposite side surfaces being spaced apart from each other in a second direction parallel to the mounting surface.