| CPC H01L 31/0481 (2013.01) [H01L 31/0488 (2013.01); H01L 31/186 (2013.01); H01L 31/1876 (2013.01)] | 15 Claims |

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1. A manufacturing method of a solar cell module, comprising:
providing a plurality of solar cells;
arranging a plurality of welding strips on a back surface of the plurality of solar cells, and welding the plurality of welding strips to the plurality of solar cells to form a solar cell string, wherein the solar cell string comprises the plurality of solar cells;
arranging a first encapsulant material on a back surface of the plurality of welding strips, to form a first encapsulant material layer;
laminating to form a laminate member by applying a pressure,
after the laminating to form the laminate member, on a back surface of the first encapsulant material layer, arranging a second encapsulant material in a local region corresponding to at least one of the plurality of welding strips, to form a second encapsulant material layer; and
wherein on a back surface of the first encapsulant material layer, arranging a second encapsulant material in a local region corresponding to at least one of the plurality of welding strips, to form a second encapsulant material layer, comprises:
applying the second encapsulant material directly in the local region, to form the second encapsulant material layer,
wherein before applying the second encapsulant material directly in the local region, to form the second encapsulant material layer and laminating to form a laminate member by applying the pressure, the manufacturing method further comprises:
arranging a flexible isolating material on the first encapsulant material layer;
after arranging the flexible isolating material, performing a step of: the laminating to form the laminate member; and
removing the flexible isolating material,
wherein after applying the second encapsulant material directly in the local region, to form the second encapsulant material layer, the manufacturing method further comprises:
covering the back surface of the solar cell string with a back plate material in a weak reactive gas atmosphere; and
curing the second encapsulant material by performing light curing, thermal curing or chemical curing to the second encapsulant material layer without a process of applying pressure to the second encapsulant material layer,
wherein the weak reactive gas is a gas whose activity is weaker than activity of air.
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