US 12,266,705 B2
Semiconductor devices having supporter structures
Hoin Lee, Hwaseong-si (KR); and Kiseok Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 20, 2024, as Appl. No. 18/668,743.
Application 18/668,743 is a continuation of application No. 17/683,765, filed on Mar. 1, 2022, granted, now 12,015,064.
Claims priority of application No. 10-2021-0100794 (KR), filed on Jul. 30, 2021.
Prior Publication US 2024/0304691 A1, Sep. 12, 2024
Int. Cl. H01L 29/423 (2006.01); H01L 29/40 (2006.01)
CPC H01L 29/423 (2013.01) [H01L 29/402 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
lower electrodes including a first electrode and second electrodes disposed around the first electrode with the first electrode as a center;
a first supporter pattern between the lower electrodes at a first height level and in contact with the first electrode;
an upper electrode on the lower electrodes and the first supporter pattern; and
a dielectric layer between the upper electrode and the lower electrodes, and between the upper electrode and the first supporter pattern,
wherein a number of the second electrodes is six,
wherein the second electrodes are spaced apart from the first electrode by a substantially equal distance,
wherein, at the first height level, the first supporter pattern surrounds an entire side surface of the first electrode, and
wherein, at the first height level, a side surface of each of the second electrodes includes a first portion covered by the first supporter pattern and a second portion covered by the dielectric layer.