US 12,266,682 B2
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies
Adel A. Elsherbini, Tempe, AZ (US); Mohammad Enamul Kabir, Portland, OR (US); Zhiguo Qian, Chandler, AZ (US); Gerald S. Pasdast, San Jose, CA (US); Kimin Jun, Portland, OR (US); Shawna M. Liff, Scottsdale, AZ (US); Johanna M. Swan, Scottsdale, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); and Feras Eid, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 18, 2020, as Appl. No. 17/025,209.
Prior Publication US 2022/0093725 A1, Mar. 24, 2022
Int. Cl. H01L 23/49 (2006.01); H01L 23/492 (2006.01); H01L 49/02 (2006.01)
CPC H01L 28/60 (2013.01) [H01L 23/49 (2013.01); H01L 23/492 (2013.01); H01L 28/20 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a capacitor comprising a first conductive plate, a second conductive plate, and a capacitor insulator separating the first conductive plate and the second conductive plate;
a first microelectronic component comprising a first insulator layer, wherein the first conductive plate is embedded in the first insulator layer and is at a direct bonding interface of the first microelectronic component; and
a second microelectronic component comprising a second insulator layer, wherein the second conductive plate is embedded in the second insulator layer and is at a direct bonding interface of the second microelectronic component, the direct bonding interface of the second microelectronic component is direct bonded to the direct bonding interface of the first microelectronic component, and the direct bonding interface of the second microelectronic component is direct bonded to the direct bonding interface of the first microelectronic component at an interface between the first insulator layer and the second insulator layer;
wherein the first conductive plate is a materially continuous closed contour, a footprint of the materially continuous closed contour encircles a footprint of the second conductive plate, and the capacitor insulator includes a part of the first insulator layer and a part of the second insulator layer.