US 12,266,677 B2
Low stress die attachment for thermal imaging focal plane arrays
Lars Mininni, Santa Barbara, CA (US); Shawn Dirksen, Santa Barbara, CA (US); and Thad Miller, Santa Barbara, CA (US)
Assigned to Seek Thermal, Inc., Goleta, CA (US)
Filed by Seek Thermal, Inc., Goleta, CA (US)
Filed on Jan. 14, 2022, as Appl. No. 17/576,296.
Claims priority of provisional application 63/137,994, filed on Jan. 15, 2021.
Prior Publication US 2022/0231059 A1, Jul. 21, 2022
Int. Cl. H01L 27/146 (2006.01); H01L 21/60 (2006.01); H01L 31/18 (2006.01); H04N 5/33 (2023.01); H04N 23/55 (2023.01)
CPC H01L 27/1469 (2013.01) [H01L 21/60 (2021.08); H01L 27/14649 (2013.01); H01L 31/18 (2013.01); H04N 5/33 (2013.01); H04N 23/55 (2023.01)] 17 Claims
OG exemplary drawing
 
1. A method for attaching an integrated circuit die to a substrate, the method comprising:
applying an adhesive in a pattern to at least one of a back surface of the die or an area of the substrate to which the die is to be attached;
applying a viscous thermally conductive material to at least one of the back surface of the die or the area of the substrate to which the die is to be attached; and
assembling, after applying the viscous thermally conductive material, the die and the substrate together by at least compressing and curing the adhesive and compressing the viscous thermally conductive material,
wherein, when the adhesive is fully compressed and cured, the adhesive covers less than 25% by area of the back surface of the die, and
wherein, when the viscous thermally conductive material is fully compressed, the viscous thermally conductive material fills at least part of the space between the die and the substrate.