US 12,266,670 B2
Method for manufacturing an optical unit that comprises an array of organic microlenses
Naor Inbar, Migdal Haemek (IL); Omer Katz, Migdal Haemek (IL); Tzur Miller, Migdal Haemek (IL); and Ayala Elkayam, Migdal Haemek (IL)
Assigned to Tower Semiconductor Ltd., Migdal Hemek (IL)
Filed by Tower Semiconductor Ltd., Migdal Haemek (IL)
Filed on Feb. 22, 2022, as Appl. No. 17/652,081.
Prior Publication US 2023/0268363 A1, Aug. 24, 2023
Int. Cl. H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H10K 10/88 (2023.01); H10K 39/32 (2023.01); H10K 50/844 (2023.01); H10K 59/80 (2023.01)
CPC H01L 27/14627 (2013.01) [H01L 23/3171 (2013.01); H01L 24/06 (2013.01); H01L 27/14685 (2013.01); H10K 10/88 (2023.02); H10K 39/32 (2023.02); H10K 50/844 (2023.02); H10K 59/873 (2023.02); H01L 2224/03831 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for manufacturing optical unit that comprises an array of organic microlenses, the method comprises:
obtaining an intermediate optical unit that comprises a semiconductor portion, a transparent organic layer, the array of organic microlenses and a protective layer;
wherein the semiconductor portion comprises a substrate, bonding pads and an image sensor pixel array; wherein the protective layer comprises a first protective layer region and a second protective layer region;
wherein the first protective layer portion is deposited on the array of organic microlenses;
wherein the second protective layer portion is deposited on a part of an upper layer of the transparent organic layer;
applying a protective mask above the first protective layer region;
removing, by applying a first etch process, the second protective layer region to expose a second region of the transparent organic layer; and
removing, by applying a second etch process, the second region of the transparent organic layer to expose the bonding pads and removing the protective mask while maintaining the first protective layer portion.