US 12,266,663 B2
Display panel having a bonding region
Pan Zhao, Beijing (CN); Zhiliang Jiang, Beijing (CN); Haigang Qing, Beijing (CN); and Shilong Wang, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/786,578
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Aug. 17, 2021, PCT No. PCT/CN2021/112967
§ 371(c)(1), (2) Date Jun. 17, 2022,
PCT Pub. No. WO2023/019425, PCT Pub. Date Feb. 23, 2023.
Prior Publication US 2024/0297182 A1, Sep. 5, 2024
Int. Cl. H01L 27/12 (2006.01); G06F 3/044 (2006.01)
CPC H01L 27/1244 (2013.01) [G06F 3/0443 (2019.05)] 20 Claims
OG exemplary drawing
 
1. A display panel, having a bonding region for bonding an integrated circuit, comprising:
a base substrate; and
a plurality of bonding pin structures on the base substrate arranged in a plurality of columns, respectively;
wherein a respective bonding pin structure comprises a respective bonding pin and connection lines on two ends of the respective bonding pin, respectively;
bonding pins of the plurality of bonding pin structures are arranged in N rows, N is a positive integer equal to or greater than 4; and
(N−1) number of connection lines pass through a region between two adjacent bonding pins arranged in a same row.