US 12,266,648 B2
Package structure
Sen-Kuei Hsu, Kaohsiung (TW); Hsin-Yu Pan, Taipei (TW); and Ming-Hsien Tsai, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 2, 2023, as Appl. No. 18/363,768.
Application 18/363,768 is a continuation of application No. 17/705,418, filed on Mar. 28, 2022, granted, now 11,824,054.
Application 17/705,418 is a continuation of application No. 17/022,064, filed on Sep. 15, 2020, granted, now 11,296,067, issued on Apr. 5, 2022.
Application 17/022,064 is a continuation of application No. 16/260,115, filed on Jan. 29, 2019, granted, now 10,818,651, issued on Oct. 27, 2020.
Prior Publication US 2023/0378152 A1, Nov. 23, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 23/5226 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/73257 (2013.01); H01L 2924/1205 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a routing structure;
at least one die, disposed over the routing structure;
at least one first semiconductor device, disposed over the routing structure, and being laterally next to the at least one die, wherein a projection of the at least one die is offset from a projection of the at least one first semiconductor device along a stacking direction of the routing structure and the at least one die;
a dielectric encapsulant, laterally encapsulating the at least one die and the at least one first semiconductor device; and
a thermal conductive encapsulant, disposed over the routing structure and further penetrating into a part of the routing structure.