US 12,266,646 B2
Electronic device
Yeong-E Chen, Miao-Li County (TW)
Assigned to Innolux Corporation, Miaolli County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on May 17, 2023, as Appl. No. 18/318,740.
Application 18/318,740 is a continuation of application No. 17/083,318, filed on Oct. 29, 2020, granted, now 11,694,999.
Claims priority of application No. 202010350313.5 (CN), filed on Apr. 28, 2020.
Prior Publication US 2023/0290764 A1, Sep. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/16 (2023.01); H01L 23/538 (2006.01); H01L 25/04 (2023.01); H01L 25/075 (2006.01); H10F 71/00 (2025.01); H10F 77/00 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01)
CPC H01L 25/167 (2013.01) [H01L 23/5386 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H10F 71/139 (2025.01); H10F 77/933 (2025.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01)] 7 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a circuit structure layer, comprising a circuit layer and a plurality of first conductive pads;
a package structure, disposed on the circuit structure layer;
an electronic element, embedded in the package structure and electrically connected to the circuit layer through the plurality of first conductive pads;
a plurality of function elements, wherein one of the plurality of function elements has a plurality of pads and a function unit, the function unit is electrically connected to the circuit structure layer through the plurality of pads, the plurality of pads are located between the function unit and the circuit structure layer, and in a top view of the electronic device, the function unit overlaps the plurality of pads; and
a protection layer, covering side surfaces of the plurality of function elements and completely covering a surface of the function unit away from the circuit structure layer,
wherein the circuit structure layer is disposed between the plurality of function elements and the electronic element,
wherein along a normal direction of the electronic element, a thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element, and a thickness of the protection layer is greater than a thickness of one of the plurality of function elements,
wherein the electronic element overlaps at least two function elements of the plurality of function elements, and the plurality of function elements arrange along a direction perpendicular to the normal direction of the electronic element.