US 12,266,645 B2
Method for manufacturing image display device and image display device
Hajime Akimoto, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Jan. 4, 2022, as Appl. No. 17/568,161.
Application 17/568,161 is a continuation of application No. PCT/JP2020/025627, filed on Jun. 30, 2020.
Claims priority of application No. 2019-128493 (JP), filed on Jul. 10, 2019.
Prior Publication US 2022/0131027 A1, Apr. 28, 2022
Int. Cl. H01L 33/00 (2010.01); H01L 25/16 (2023.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/32 (2010.01)
CPC H01L 25/167 (2013.01) [H01L 33/0093 (2020.05); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/007 (2013.01); H01L 33/32 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for manufacturing an image display device, the method comprising:
providing a second substrate that comprises a first substrate, and a semiconductor layer on the first substrate, the semiconductor layer comprising a light-emitting layer;
providing a third substrate comprising a circuit, the circuit comprising a circuit element;
bonding the semiconductor layer to the third substrate;
forming a light-emitting element by etching the semiconductor layer;
covering the light-emitting element with a light-transmissive insulating member; and
forming a wiring layer electrically connecting the light-emitting element to the circuit element; wherein:
the light-emitting element has a light-emitting surface opposite to a surface of the light-emitting element that is bonded to the third substrate; and
the insulating member is configured to cause light radiated from the light-emitting element to have a light distribution in a normal direction of the light-emitting surface toward a light-emitting surface side.