CPC H01L 25/167 (2013.01) [H01L 33/0093 (2020.05); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/007 (2013.01); H01L 33/32 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01)] | 12 Claims |
1. A method for manufacturing an image display device, the method comprising:
providing a second substrate that comprises a first substrate, and a semiconductor layer on the first substrate, the semiconductor layer comprising a light-emitting layer;
providing a third substrate comprising a circuit, the circuit comprising a circuit element;
bonding the semiconductor layer to the third substrate;
forming a light-emitting element by etching the semiconductor layer;
covering the light-emitting element with a light-transmissive insulating member; and
forming a wiring layer electrically connecting the light-emitting element to the circuit element; wherein:
the light-emitting element has a light-emitting surface opposite to a surface of the light-emitting element that is bonded to the third substrate; and
the insulating member is configured to cause light radiated from the light-emitting element to have a light distribution in a normal direction of the light-emitting surface toward a light-emitting surface side.
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