US 12,266,638 B2
Semiconductor package
Sangcheon Park, Hwaseong-si (KR); and Youngmin Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 24, 2023, as Appl. No. 18/174,129.
Application 18/174,129 is a continuation of application No. 17/203,909, filed on Mar. 17, 2021, granted, now 11,621,247.
Claims priority of application No. 10-2020-0114963 (KR), filed on Sep. 8, 2020.
Prior Publication US 2023/0215843 A1, Jul. 6, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/12 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
an upper structure including an upper insulating layer, first upper pads and second upper pads, the first upper pads disposed in a first area and having the same size, the second upper pads being around the first area and having a plurality of sizes, and the upper insulating layer covering side surfaces of the first upper pads and the second upper pads; and
a lower structure including a lower insulating layer, first lower pads and second lower pads, the lower insulating layer being bonded to the upper insulating layer, the first lower pads bonded to the first upper pads, respectively, and the second lower pads being around the first lower pads and bonded to the second upper pads, respectively,
wherein sizes of the second upper pads are different from the first upper pads and decrease with distance from the first area.