| CPC H01L 25/0657 (2013.01) [H01L 23/3128 (2013.01); H01L 25/50 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2225/06562 (2013.01)] | 20 Claims |
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1. A device, comprising:
a substrate;
a first die on the substrate;
a second die on the first die, the second die spaced apart from the substrate by the first die;
a first resin on the substrate, the first die, and the second die, the first resin having a plurality of steps, and the first resin enclosing the first die and the second die;
a first conductive layer electrically coupled to the substrate, the first die, and the second die, the first conductive layer being on the plurality of steps of the first resin and extends continuously along the plurality of steps; and
a second resin on the first resin and on the first conductive layer.
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