US 12,266,635 B2
Semiconductor device package having dummy dies
Che-Chia Yang, Taipei (TW); Shu-Shen Yeh, Taoyuan (TW); Po-Chen Lai, Hsinchu (TW); Ming-Chih Yew, Hsinchu (TW); Po-Yao Lin, Zhudong Township (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 5, 2022, as Appl. No. 17/817,705.
Application 17/817,705 is a division of application No. 17/097,059, filed on Nov. 13, 2020.
Prior Publication US 2022/0384390 A1, Dec. 1, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/0655 (2013.01) [H01L 23/3185 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/16157 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a substrate;
a first package component and a second package component disposed over and bonded to the substrate, wherein the first and second package components are different types of electronic components that provide different functions;
at least one dummy die disposed over and attached to the substrate, wherein the dummy die is between the first and second package components and is electrically isolated from the substrate, and
wherein the dummy die has a first portion between adjacent sidewalls of the first and second package components and attached to the package substrate, and a second portion extending continuously from the first portion to top surfaces of the first and second package components; and
an underfill element disposed between the substrate, the first package component, the second package component and the at least one dummy die, wherein the underfill element has a maximum height lower than a bottom surface of the second portion of the dummy die.