US 12,266,634 B2
Vertically mounted die groups
Jen-Yuan Chang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Sep. 24, 2023, as Appl. No. 18/473,273.
Application 18/473,273 is a division of application No. 17/534,395, filed on Nov. 23, 2021, granted, now 11,929,348.
Claims priority of provisional application 63/186,043, filed on May 7, 2021.
Prior Publication US 2024/0014172 A1, Jan. 11, 2024
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/0652 (2013.01) [H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/50 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06555 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating a three-dimensional multi-die device, the method comprising:
providing a plurality of die groups comprising a first die group including a first bonding member and a plurality of first dies stacked parallel to each other and parallel to a front surface of the first die group, a second die group including a second bonding member and a plurality of second dies stacked parallel to each other and parallel to a front surface of the second die group;
providing a base substrate structure comprising a third die group comprising a substrate characterized by a lattice crystalline plane, wherein the lattice crystalline plane, when projected on a top surface of the third die group, extends in a third direction; and
bonding the first die group sideways and perpendicularly on the top surface of the third die group, wherein the front surface of the first die group and the top surface of the third die group intersect at a first edge, and the first edge extends in a first direction in the top surface of the third die group; and
bonding the second die group sideways and perpendicularly on the top surface of the third die group, wherein the front surface of the second die group and the top surface of the third die group intersect at a second edge, and the second edge extends in a second direction in the top surface of the third die group; and
wherein at least one of the first direction and the second direction is non-parallel to the third direction.