CPC H01L 24/96 (2013.01) [H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/3135 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/6835 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/91 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01)] | 7 Claims |
1. A package structure, comprising:
a first semiconductor device;
a second semiconductor device disposed over the first semiconductor device;
a conductive bump connected to the first semiconductor device and the second semiconductor device;
a first underfill disposed between the first semiconductor device and the second semiconductor device, and covering a lateral surface of the conductive bump;
a second molding compound covering the second semiconductor device and a lateral surface of the first underfill, wherein the second molding compound is spaced apart from the first semiconductor device;
a second underfill disposed under the first semiconductor device, wherein at least a portion of the second underfill is spaced apart from a lateral surface of the first semiconductor device; and
a third molding compound covering a lateral surface of the second semiconductor device and laterally overlapping the second underfill.
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