US 12,266,628 B2
Semiconductor package having a metal clip and related methods of manufacturing
Engku Izyan Munirah E Afandi, Selangor (MY); Wee Peng Chong, Melaka (MY); and Joel Feliciano Del Rosario, Malacca (MY)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Aug. 10, 2022, as Appl. No. 17/885,184.
Prior Publication US 2024/0055387 A1, Feb. 15, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 23/495 (2006.01)
CPC H01L 24/40 (2013.01) [H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 24/05 (2013.01); H01L 24/84 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/4007 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/84801 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a semiconductor die attached to a lead frame and having a first bond pad at a side of the semiconductor die facing away from the lead frame;
a metal clip having a first bonding region attached to the first bond pad by a solder joint, the metal clip providing an electrical pathway to the first bond pad; and
an additional electrical pathway to the first bond pad,
wherein a first end of the additional electrical pathway is attached to the first bond pad,
wherein at one or more locations between the first end and a second end of the additional electrical pathway, the additional electrical pathway is attached to a surface of the first bonding region of the metal clip that faces away from the first bond pad.