US 12,266,621 B2
Display panel, method of manufacturing display panel, and display device
Jinming Shi, Guangdong (CN); and Huiru Zhao, Guangdong (CN)
Assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Guangdong (CN)
Appl. No. 17/622,229
Filed by TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Dec. 16, 2021, PCT No. PCT/CN2021/138736
§ 371(c)(1), (2) Date Dec. 22, 2021,
PCT Pub. No. WO2023/097793, PCT Pub. Date Jun. 8, 2023.
Claims priority of application No. 202111460450.5 (CN), filed on Dec. 2, 2021.
Prior Publication US 2024/0038697 A1, Feb. 1, 2024
Int. Cl. H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 24/05 (2013.01) [H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/167 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80805 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a display substrate on which a display area and a first bonding area located at a periphery of the display area are defined; and
a circuit board on which a second bonding area is defined;
wherein the first bonding area of the display substrate and the second bonding area of the circuit board are connected by a bonding structure, and a width of the bonding structure ranging from 50 (microns) μm to 200 μm;
wherein the bonding structure comprises a first metal layer, a second metal layer, and a third metal layer which are stacked in sequence, cross-sections of the first metal layer, the second metal layer and the third metal layer are all in a rectangular shape; the first metal layer has a top surface and a bottom surface, the second metal layer has a top surface and a bottom surface, and the top surface of the first metal layer and the bottom surface of the second metal layer are coplanar;
wherein the display substrate comprises a substrate, and a thin-film transistor (TFT) layer and a connecting layer which are spaced apart on the substrate, the TFT layer is located in the display area, and the connecting layer is located in the first bonding area, the connecting layer comprises a first metal composite layer and a second metal composite layer which are stacked.