US 12,266,614 B2
Molded laser package with electromagnetic interference shield and method of making
DeokKyung Yang, Incheon Si (KR); HunTeak Lee, Gyeongi-do (KR); HeeSoo Lee, Kyunggi-do (KR); Wanil Lee, Incheon-Si (KR); and SangDuk Lee, Dublin, CA (US)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Jan. 18, 2023, as Appl. No. 18/155,878.
Application 18/155,878 is a continuation of application No. 17/163,776, filed on Feb. 1, 2021, granted, now 11,587,882.
Application 17/163,776 is a continuation of application No. 16/193,691, filed on Nov. 16, 2018, granted, now 10,937,741, issued on Mar. 2, 2021.
Prior Publication US 2023/0154864 A1, May 18, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
providing a semiconductor die;
disposing the semiconductor die over a substrate;
depositing an encapsulant over the semiconductor die and substrate;
forming a trench in the encapsulant around the semiconductor die;
forming a shielding layer over the encapsulant and into the trench;
forming an opening in the shielding layer;
disposing a solder bump in the opening;
forming an antenna on the substrate opposite the semiconductor die; and
mounting the semiconductor die to a printed circuit board (PCB) by reflowing the solder bump onto a contact pad of the PCB, wherein the PCB is larger than the substrate.