US 12,266,611 B2
Mixed density interconnect architectures using hybrid fan-out
Rahul Agarwal, Santa Clara, CA (US); Brett P. Wilkerson, Austin, TX (US); and Raja Swaminathan, Austin, TX (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Oct. 30, 2020, as Appl. No. 17/084,885.
Claims priority of provisional application 63/064,697, filed on Aug. 12, 2020.
Prior Publication US 2022/0051989 A1, Feb. 17, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 23/5383 (2013.01); H01L 24/20 (2013.01); H01L 24/82 (2013.01); H01L 2224/2101 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor module including:
first and second dies each including a mixed density of input/output interconnects on a first die surface, the mixed density of input/output interconnects comprising a first group of interconnects and a second group of interconnects, the first group of interconnects having an interconnect density that is different from the second group of interconnects; and
a first interconnect structure including a first plurality of connection pathways and a second plurality of connection pathways fabricated together in a same redistribution layer structure, the first plurality of connection pathways directly connecting the first group of interconnects on the first die to the first group of interconnects on the second die, the second plurality of connection pathways connecting the second group of interconnects on the first die to one or more package interconnects, wherein a first pathway density of the first plurality of connection pathways is different from a pathway density of the second pathway density;
one or more peripheral components external to the semiconductor module; and
a second interconnect structure connecting the semiconductor module to the one or more peripheral components, wherein the second interconnect structure includes an interconnect die coupled to the second plurality of connection pathways.