US 12,266,610 B2
Semiconductor package device and method for manufacturing the same
Yencheng Kuo, Kaohsiung (TW); and Shao-Lun Yang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Koahsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Sep. 12, 2022, as Appl. No. 17/942,984.
Application 17/942,984 is a continuation of application No. 16/917,335, filed on Jun. 30, 2020, granted, now 11,444,032.
Prior Publication US 2023/0005841 A1, Jan. 5, 2023
Int. Cl. H01L 23/538 (2006.01); B81B 7/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/5384 (2013.01) [B81B 7/0074 (2013.01); H01L 21/486 (2013.01); H01L 23/49838 (2013.01); H01L 24/45 (2013.01); H01L 25/16 (2013.01); H01L 2924/1461 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor package device, comprising:
a first mold material;
a first hole extending through the first mold material;
a first electronic component disposed under the first mold material and configured to receive a physical signal through the first hole;
a substrate supporting the first electronic component; and
an antenna disposed under and electrically connected to the substrate.