US 12,266,598 B2
Dense via pitch interconnect to increase wiring density
Francesco Preda, New Braunfels, TX (US); Sungjun Chun, Austin, TX (US); Jose A. Hejase, Pflugerville, TX (US); Junyan Tang, Austin, TX (US); Pavel Roy Paladhi, Pflugerville, TX (US); Nam Huu Pham, Round Rock, TX (US); Wiren Dale Becker, Hyde Park, NY (US); and Daniel Mark Dreps, Georgetown, TX (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Oct. 24, 2022, as Appl. No. 18/049,143.
Prior Publication US 2024/0136270 A1, Apr. 25, 2024
Prior Publication US 2024/0234284 A9, Jul. 11, 2024
Int. Cl. H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H05K 1/0228 (2013.01); H05K 1/0243 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 1/0237 (2013.01); H05K 1/0284 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) interconnect package comprising:
a substrate core;
a plurality of buildup layers disposed above and below the substrate core, wherein the plurality of buildup layers comprises:
a top layer disposed above the substrate core, the top layer comprising a plurality of contacts to electrically and mechanically connect to a chip or die;
a second layer comprising a plurality of signal lines; and
a bottom layer disposed below the substrate core, the bottom layer comprising a plurality of Land Grid Array (LGA) contacts;
a plurality of interconnect vias extending vertically through the substrate core, the plurality of interconnect vias connecting the plurality of contacts with the plurality of LGA contacts through a plurality of micro-vias,
wherein a differential signal via pair of the plurality of interconnect vias comprises a first via and a second via that are electrically connected to a respective LGA contact of the plurality of LGA contacts, each of the first via and the second via at least partly overlapping with the respective LGA contact and offset inwardly from a center axis of the respective LGA contact, and
wherein, for each via of the first via and the second via, a respective two or more signal lines of the plurality of signal lines overlap with the respective LGA contact without overlapping the via.