US 12,266,596 B2
Semiconductor device with a power converter module connected to connection assembly
Rajen Manicon Murugan, Dallas, TX (US); and Yiqi Tang, Allen, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Apr. 12, 2021, as Appl. No. 17/227,722.
Claims priority of provisional application 63/056,302, filed on Jul. 24, 2020.
Prior Publication US 2022/0028770 A1, Jan. 27, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H02M 1/00 (2007.01)
CPC H01L 23/49822 (2013.01) [H01L 21/4825 (2013.01); H01L 23/49838 (2013.01); H02M 1/0067 (2021.05)] 23 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a die comprising a power converter module, wherein the power converter module includes an output port and a return port;
a connection assembly comprising:
pads abutting a surface of the semiconductor device;
a first layer patterned to include a first trace that is directly coupled to one of the output port and the return port of the power converter module and a second trace that is directly coupled to the other of the output port and return port of the power converter module;
a second layer patterned to provide a first via between the first trace and a third layer of the connection assembly and a second via between the second trace and the third layer of the connection assembly; and
the third layer of the connection assembly being patterned to provide a portion of a first conductive path between the first via and a first pad of the pads and a portion of a second conductive path between the second via and a second pad of the pads.