US 12,266,591 B2
Choked flow cooling
Mark Forsnes, Folsom, CA (US); Yuhong Cai, Folsom, CA (US); Florence Pon, Folsom, CA (US); and Yi Xu, Folsom, CA (US)
Assigned to SK hynix NAND Product Solutions Corp., Rancho Cordova, CA (US)
Filed by SK hynix NAND Product Solutions Corp., Rancho Cordova, CA (US)
Filed on Jan. 24, 2024, as Appl. No. 18/421,728.
Application 18/421,728 is a continuation of application No. 16/176,707, filed on Oct. 31, 2018, granted, now 11,901,264.
Prior Publication US 2024/0170368 A1, May 23, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/467 (2006.01); H01L 23/04 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/467 (2013.01) [H01L 23/04 (2013.01); H01L 23/538 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An apparatus for cooling a die, comprising:
a lid over configured to be positioned over the die, wherein the lid has a first opening and a second opening that is opposite from the first opening and wherein air flows from the first opening to the second opening; and
a plate partially closing the first opening, wherein the plate comprises a first surface facing away from the die, a second surface facing the die, and a plurality of vents extending from the first surface to the second surface, wherein first openings of the plurality of vents have a first dimension and second openings of the plurality of vents have a second dimension that is smaller than the first dimension, and
wherein, when the lid is positioned over a structure containing the die and the plate is partially closing the first opening, all of the air that flows from the first opening to the second opening flows through the plurality of vents in the plate partially closing the first opening.