| CPC H01L 23/3675 (2013.01) [H01L 23/373 (2013.01); H01L 23/5225 (2013.01)] | 23 Claims |
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1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
disposing a tape over the semiconductor die;
depositing an encapsulant over the substrate, semiconductor die, and tape;
removing the tape to leave a cavity in the encapsulant over the semiconductor die;
forming a shielding layer over the encapsulant and semiconductor die; and
disposing a heat spreader over the shielding layer, wherein the heat spreader includes a protrusion extending into the cavity of the encapsulant.
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