US 12,266,583 B2
Flip chip package unit and associated packaging method
Yingjiang Pu, Chengdu (CN); Hunt Hang Jiang, Saratoga, CA (US); and Xiuhong Guo, Chengdu (CN)
Assigned to Chengdu Monolithic Power Systems Co., Ltd., Sichuan (CN)
Filed by Chengdu Monolithic Power Systems Co., Ltd., Chengdu (CN)
Filed on Apr. 4, 2022, as Appl. No. 17/712,323.
Claims priority of application No. 202110435460.7 (CN), filed on Apr. 22, 2021.
Prior Publication US 2022/0344231 A1, Oct. 27, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01)
CPC H01L 23/3164 (2013.01) [H01L 21/6836 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 23/293 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A flip chip package unit, comprising:
an integrated circuit (“IC”) die, having a first die surface and a second die surface opposite to the first die surface, and a plurality of metal pillars formed on the first die surface;
a rewiring substrate, having a first substrate surface and a second substrate surface opposite to the first substrate surface, wherein the IC die is attached to the rewiring substrate with the first die surface facing to the second substrate surface;
an under-fill material, filling gaps between the first die surface and the rewiring substrate; and
a back protective film, attached to the second die surface of the IC die, the back protective film comprising one or more adhesive films, and wherein the back protective film has a thickness of no thicker than 100 μm.