| CPC H01L 23/3142 (2013.01) [H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/291 (2013.01); H01L 23/315 (2013.01); H01L 23/481 (2013.01); H01L 23/3736 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49176 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01403 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15763 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/16747 (2013.01); H01L 2924/1676 (2013.01); H01L 2924/173 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/1776 (2013.01); H01L 2924/3512 (2013.01)] | 21 Claims |

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1. A package comprising:
a metal base having a top surface; and
multiple ceramic wall segments discrete from each other and having no overlap in a horizontal plane, wherein:
a gap exists between every two adjacent ceramic wall segments and is sealed with a connecting material, wherein the ceramic wall segments and the connecting material are formed of different materials;
each of the ceramic wall segments and the connecting material form a ring wall, wherein the gap between every two adjacent ceramic wall segments is located at a corner of the ring wall;
the metal base has a coefficient of thermal expansion (CTE)>11 μm/m·K, and each ceramic wall segment has a CTE<9 μm/m·K; and
the metal base is surrounded by the ring wall, wherein each side surface of the metal base is fully covered by the ring wall, and at least a portion of the top surface of the metal base is exposed through the ring wall.
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