US 12,266,580 B2
Semiconductor device including differential height PCB
Nandha Kumar Mohanraj, Bengaluru (IN); Jegathese Dhanachandra Prakash, Bengaluru (IN); and Tamilselvan Krishnamoorthy, Bengaluru (IN)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by WESTERN DIGITAL TECHNOLOGIES, INC., San Jose, CA (US)
Filed on Jan. 10, 2022, as Appl. No. 17/572,344.
Prior Publication US 2023/0223307 A1, Jul. 13, 2023
Int. Cl. H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/13 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 25/0652 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate comprising:
a first section comprising contact fingers configured to electrically couple the semiconductor device to a connector of a host device, the first section having a first thickness, and
a second section having a second thickness thinner than the first thickness;
one or more semiconductor dies mounted on the second section of the substrate and electrically coupled to the contact fingers in the first section of the substrate; and
mold compound encapsulating the one or more semiconductor dies on the second section, the mold compound leaving the contact fingers uncovered and exposed;
wherein the substrate comprises a first flat planar surface and a second surface, opposed to the first surface, comprising differential heights of the first and second sections.