US 12,266,561 B2
Apparatus for treating substrate and method of coupling support unit
Sang Min Lee, Seoul (KR); and Do Hyeon Yoon, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Nov. 18, 2021, as Appl. No. 17/529,649.
Claims priority of application No. 10-2020-0159562 (KR), filed on Nov. 25, 2020.
Prior Publication US 2022/0165606 A1, May 26, 2022
Int. Cl. H01L 21/687 (2006.01); B08B 3/02 (2006.01); B08B 3/08 (2006.01)
CPC H01L 21/6875 (2013.01) [H01L 21/68785 (2013.01); B08B 3/02 (2013.01); B08B 3/08 (2013.01); H01L 21/68757 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the apparatus comprising:
a process chamber including a first body and a second body which are combined with each other to form a treatment space therein for treating a substrate;
a driver configured to move the process chamber to an open position or a close position;
a support unit configured to support a substrate within the treatment space; and
a fluid supply unit configured to supply a fluid to the treatment space,
wherein the support unit includes:
a support pin coupled to the first body or the second body, the support pin including a body portion and a recess portion; and
a guide member coupled to the support pin and extending in a lateral direction of the support pin to support the substrate,
wherein the guide member is fixed to the body portion of the support pin by a ring member which is coupled to the recess portion of the support pin and prevents the guide member from being separated.