US 12,266,560 B2
Film thickness uniformity improvement using edge ring and bias electrode geometry
Kin Pong Lo, Fremont, CA (US); Vladimir Nagorny, Tracy, CA (US); Wei Liu, San Jose, CA (US); Theresa Kramer Guarini, San Jose, CA (US); Bernard L. Hwang, Santa Clara, CA (US); Malcolm J. Bevan, Santa Clara, CA (US); Jacob Abraham, San Jose, CA (US); and Swayambhu Prasad Behera, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 6, 2022, as Appl. No. 17/832,775.
Application 17/832,775 is a continuation of application No. 16/939,898, filed on Jul. 27, 2020, granted, now 11,380,575.
Prior Publication US 2022/0301920 A1, Sep. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/687 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68735 (2013.01) [C23C 16/45536 (2013.01); C23C 16/4585 (2013.01); H01J 37/321 (2013.01); H01J 37/32623 (2013.01); H01J 37/32651 (2013.01); H01L 21/67017 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An edge ring for substrate processing comprising:
a ring shaped body comprising:
a bottom surface;
an upper surface;
an inner surface connecting the bottom surface and the upper surface and forming an opening centered around a central axis;
a plurality of protrusions extending from the upper surface and spaced around the opening;
a cantilever portion extending from the inner surface and configured to support a substrate thereon; and
an annular groove formed in the upper surface and extending towards the bottom surface and radially outward from the plurality of protrusions, the annular groove configured to receive a portion of an overhang ring,
wherein the bottom surface further comprises:
an inner bottom surface disposed below the plurality of protrusions;
a primary bottom surface disposed below the annular groove; and
a lower stepped surface connecting the inner bottom surface and the primary bottom surface.