US 12,266,558 B2
Adhesive tapes for receiving discrete components
Val Marinov, Fargo, ND (US); Matthew R. Semler, Fargo, ND (US); and Samuel Brown, West Fargo, ND (US)
Assigned to Kulicke & Soffa Netherlands B.V., Eindhoven (NL)
Appl. No. 17/783,987
Filed by KULICKE & SOFFA NETHERLANDS B.V., Eindhoven (NL)
PCT Filed Dec. 7, 2020, PCT No. PCT/US2020/063609
§ 371(c)(1), (2) Date Jun. 9, 2022,
PCT Pub. No. WO2021/126580, PCT Pub. Date Jun. 24, 2021.
Claims priority of provisional application 62/949,013, filed on Dec. 17, 2019.
Prior Publication US 2023/0017084 A1, Jan. 19, 2023
Int. Cl. H01L 21/683 (2006.01); C09J 7/22 (2018.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01)
CPC H01L 21/6836 (2013.01) [C09J 7/22 (2018.01); C09J 7/38 (2018.01); C09J 7/403 (2018.01); C09J 2203/326 (2013.01); C09J 2301/302 (2020.08); C09J 2301/416 (2020.08); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A tape for receiving a discrete component transferred by a laser-assisted transfer process, the tape comprising:
a flexible polymer substrate;
a dynamic release structure disposed on the flexible polymer substrate; and
an adhesive die catching film disposed on the dynamic release structure, wherein the adhesive die catching film receives the discrete component via the laser-assisted transfer process,
wherein the tape is used during a subsequent laser-assisted transfer process to transfer the discrete component to another substrate.