CPC H01L 21/68 (2013.01) [G05B 19/402 (2013.01); H01L 21/67144 (2013.01); H01L 21/6838 (2013.01); G05B 2219/49191 (2013.01)] | 19 Claims |
1. A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, the method comprising the steps of:
(a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system;
(b) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly;
(c) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly in response to the vacuum leakage sensed in step (b) until an acceptable level of vacuum leakage is sensed;
(d) moving the bonding tool assembly to an alignment height after step (c); and
(e) determining a tilt change caused by moving the bonding tool assembly to the alignment height.
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