US 12,266,555 B2
Magnetic transfer apparatus and fabrication method of the same
Tae-Yeon Seong, Seoul (KR); Da-Hoon Lee, Seoul (KR); and Jong-Ho Kim, Pyeongtaek-si (KR)
Assigned to KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, Seoul (KR)
Filed by KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, Seoul (KR)
Filed on Mar. 14, 2024, as Appl. No. 18/605,298.
Application 18/605,298 is a division of application No. 17/536,831, filed on Nov. 29, 2021, granted, now 11,961,750.
Claims priority of application No. 10-2021-0012966 (KR), filed on Jan. 29, 2021.
Prior Publication US 2024/0222173 A1, Jul. 4, 2024
Int. Cl. H01L 21/677 (2006.01); B65G 54/02 (2006.01)
CPC H01L 21/67709 (2013.01) [H01L 21/67715 (2013.01); H01L 21/67721 (2013.01); B65G 54/02 (2013.01); Y10T 29/49075 (2015.01)] 5 Claims
OG exemplary drawing
 
1. An inspection and transfer method of LED devices, the inspection and transfer method comprising:
manufacturing LED devices on a growth substrate and then attaching a vertical conductive temporary substrate to the LED devices;
separating the growth substrate and the LED devices from each other and transferring the separated LED devices to the vertical conductive temporary substrate;
connecting a probe circuit to the temporary substrate to inspect the LED devices such that the LED devices are classified based on characteristics of the LED devices;
forming a magnetic layer on each of the LED devices; and
transferring the LED devices, each including the magnetic layer formed thereon, to a final substrate using a magnetic transfer apparatus.