US 12,266,553 B2
Annealing method
Yung-Chang Huang, Taichung (TW); and Yu-Chi Tsai, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Feb. 17, 2023, as Appl. No. 18/171,224.
Application 18/171,224 is a continuation of application No. 16/297,058, filed on Mar. 8, 2019, granted, now 11,587,807.
Claims priority of provisional application 62/751,702, filed on Oct. 28, 2018.
Prior Publication US 2023/0197484 A1, Jun. 22, 2023
Int. Cl. H01L 21/67 (2006.01); B25J 9/16 (2006.01); B25J 11/00 (2006.01); H01L 21/324 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67259 (2013.01) [B25J 9/1674 (2013.01); B25J 11/0095 (2013.01); H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 21/68707 (2013.01); G05B 2219/45031 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for annealing a wafer comprising:
loading the wafer to a fork of a delivering robot in an annealing apparatus, wherein the wafer is in contact with a vibration-detecting sensor on the fork, and the vibration-detecting sensor is a micro electro mechanical system (MEMS) sensor;
rotating the fork between a heating plate and a cooling plate of the annealing apparatus;
outputting, by the vibration-detecting sensor, a first signal in response to a motion of the fork of the delivering robot when the wafer is loaded on the fork; and
providing, by a circuitry of the annealing apparatus, a response in response to the first signal.