US 12,266,551 B2
Apparatus, system, and method for non-contact temperature monitoring of substrate supports
Bhaskar Prasad, Jamshedpur (IN); Kirankumar Neelasandra Savandaiah, Bangalore (IN); Thomas Brezoczky, Los Gatos, CA (US); and Srinivasa Rao Yedla, Bangalore (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 15, 2023, as Appl. No. 18/317,347.
Application 18/317,347 is a continuation of application No. 16/939,629, filed on Jul. 27, 2020, granted, now 11,749,542.
Prior Publication US 2023/0282500 A1, Sep. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67248 (2013.01) [H01L 22/12 (2013.01); H01L 21/6833 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a substrate support removably coupled to a pedestal hub that defines at least a portion of a hub volume within a processing volume of a processing chamber, the substrate support comprising a substrate interfacing surface and a back surface;
wherein:
the pedestal hub comprises a set of contact pins disposed on a top surface of the pedestal hub,
the back surface of the substrate support comprises a set of contact terminals each having a repositioning feature configured to detachably connect and disconnect with a corresponding repositioning feature of each contact pin of the set of contact pins, and
one or more of the contact terminals and the contact pins comprise a detachable connection region that is configured to align the substrate support to the pedestal hub when the contact terminals of the substrate support are disposed on the contact pins of the pedestal hub.