| CPC H01L 21/6715 (2013.01) [H01L 21/68764 (2013.01)] | 7 Claims |
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1. A fluid supply spray nozzle for semiconductor substrate treatment, which supplies a treatment liquid in which a plurality of solutions are mixed to a semiconductor substrate, the fluid supply nozzle comprising:
a nozzle body configured to mix the plurality of solutions to form a treatment liquid when the plurality of solutions are supplied into an inner space, the nozzle body having a shape with an open upper portion;
a solution supply channel with a plurality of solution supply pipes for supplying the plurality of solutions to the inner space;
a solution guide device comprising a plurality of screw threads configured to form flow paths through which the plurality of solutions flow together with wall surfaces of the inner space, and configured to guide the plurality of solutions and generate a rotary current or an eddy current to mix the plurality of solutions; and
a rotary cartridge configured to accelerate the mixing of the plurality of solutions to generate a homogeneous treatment liquid after the plurality of solutions are flowed through the flow paths formed by the screw threads, wherein the solution guide device comprises: a cover part configured to open or close the open upper portion of the nozzle body,
wherein the rotary cartridge comprises:
a rotary shaft having an upper portion rotatably fixed to the cover part of the solution guide device; and
at least one first blade and at least one second blade which are spaced apart from each other in a longitudinal direction of the rotary shaft, and
the rotary cartridge is replaceably provided in the nozzle body,
wherein the nozzle body comprises a discharge port for discharging the treatment liquid directly to the semiconductor substrate, and
wherein the discharge port is provided at a bottom of the nozzle body.
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