US 12,266,544 B2
Reversed tone patterning method for dipole incorporation for multiple threshold voltages
Lung-Kun Chu, Hsinchu (TW); Jia-Ni Yu, Hsinchu (TW); Chun-Fu Lu, Hsinchu (TW); Kuo-Cheng Chiang, Hsinchu (TW); and Chih-Hao Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 24, 2024, as Appl. No. 18/645,181.
Application 18/645,181 is a division of application No. 17/890,980, filed on Aug. 18, 2022, granted, now 11,996,298.
Claims priority of provisional application 63/337,912, filed on May 3, 2022.
Prior Publication US 2024/0282587 A1, Aug. 22, 2024
Int. Cl. H01L 29/00 (2006.01); H01L 21/475 (2006.01); H01L 21/4757 (2006.01); H01L 21/477 (2006.01); H01L 27/088 (2006.01); H01L 29/423 (2006.01); H01L 29/51 (2006.01)
CPC H01L 21/477 (2013.01) [H01L 21/475 (2013.01); H01L 21/47573 (2013.01); H01L 27/0886 (2013.01); H01L 29/42392 (2013.01); H01L 29/517 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a first transistor having a first threshold voltage and including:
a plurality of stacked first channel regions; and
a first high-K dielectric layer surrounding each of the first channel regions; and
a first gate metal in contact with the first high-K dielectric layer;
a second transistor having a second threshold voltage different than the first threshold voltage and including:
a plurality of stacked second channel regions;
a second high-K dielectric layer surrounding each of the second channel regions;
a first intermixing layer surrounding and in contact with the second high-K dielectric layer; and
a second gate metal in contact with the first intermixing layer, wherein the first intermixing layer includes material from the second high-K dielectric layer and a previously removed first hard mask layer.