US 12,266,512 B2
Plasma processing apparatus
Dukhyun Son, Cheonan-si (KR); Jaewon Shin, Seoul (KR); and Hyungjoon Kim, Pyeongtaek-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Mar. 27, 2023, as Appl. No. 18/190,442.
Claims priority of application No. 10-2022-0041230 (KR), filed on Apr. 1, 2022.
Prior Publication US 2023/0317428 A1, Oct. 5, 2023
Int. Cl. H01J 37/32 (2006.01); H01J 37/34 (2006.01)
CPC H01J 37/32669 (2013.01) [H01J 37/3244 (2013.01); H01J 37/32458 (2013.01); H01J 37/3455 (2013.01); H01J 2237/334 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A plasma processing apparatus, the apparatus comprising
a housing defining a space accommodating a wafer therein;
a gas supply member configured to supply gas into the housing;
a plasma source generating a plasma from the gas supplied into the housing; and
a magnetic field generating member disposed on the housing and configured to generate a magnetic field inside the housing, wherein the magnetic field generating member comprises:
a first magnet unit disposed on the housing and including a first pole and a second pole; and
a second magnet unit spaced from the first magnet unit and including a first pole and a second pole, wherein
the second magnet unit is rotatable relative to the first magnet unit between a first position where the first pole of the second magnet opposes the first pole of the first magnet, and a second position wherein the second pole of the second magnet opposes the first pole of the first magnet.