US 12,266,511 B2
Substrate support and substrate processing apparatus
Chishio Koshimizu, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Nov. 25, 2020, as Appl. No. 17/104,038.
Claims priority of application No. 2019-213643 (JP), filed on Nov. 26, 2019; and application No. 2020-121686 (JP), filed on Jul. 15, 2020.
Prior Publication US 2021/0159057 A1, May 27, 2021
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32642 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32568 (2013.01); H01J 37/32577 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate support comprising:
a substrate mounting surface on which a substrate is mounted;
an edge ring mounting surface on which an edge ring is mounted around the substrate mounting surface;
wherein the substrate support includes a base and an electrostatic chuck for chucking the substrate in a dielectric material over the base;
wherein the dielectric material covers the sides of the base and extends at least partially under the base;
a conductive electrode formed on the edge ring mounting surface and configured to apply a voltage to the edge ring,
wherein the conductive electrode is exposed to the edge ring mounting surface and contacts with a back surface of the edge ring,
wherein a feeding wiring
embedded in the dielectric material wraps around the electrostatic chuck, side of the base and at least partially under the base and provides power to the conductive electrode;
a chucking electrode for attracting the edge ring embedded in the dielectric below the feeding wire;
wherein the conductive electrode is configured to supply a voltage to the edge ring and is formed on the dielectric material so that at least a part of the dielectric material is exposed on the edge ring mounting surface.