CPC H01J 37/32642 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32568 (2013.01); H01J 37/32577 (2013.01)] | 11 Claims |
1. A substrate support comprising:
a substrate mounting surface on which a substrate is mounted;
an edge ring mounting surface on which an edge ring is mounted around the substrate mounting surface;
wherein the substrate support includes a base and an electrostatic chuck for chucking the substrate in a dielectric material over the base;
wherein the dielectric material covers the sides of the base and extends at least partially under the base;
a conductive electrode formed on the edge ring mounting surface and configured to apply a voltage to the edge ring,
wherein the conductive electrode is exposed to the edge ring mounting surface and contacts with a back surface of the edge ring,
wherein a feeding wiring
embedded in the dielectric material wraps around the electrostatic chuck, side of the base and at least partially under the base and provides power to the conductive electrode;
a chucking electrode for attracting the edge ring embedded in the dielectric below the feeding wire;
wherein the conductive electrode is configured to supply a voltage to the edge ring and is formed on the dielectric material so that at least a part of the dielectric material is exposed on the edge ring mounting surface.
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