US 12,266,508 B2
Plasma processing apparatus and method for venting a processing chamber to atmosphere
Kazuyuki Ikenaga, Tokyo (JP); and Masaru Matsuzaki, Tokyo (JP)
Assigned to Hitachi High-Tech Corporation, Tokyo (JP)
Filed by Hitachi High-Tech Corporation, Tokyo (JP)
Filed on Nov. 20, 2020, as Appl. No. 16/953,914.
Application 16/953,914 is a division of application No. 16/124,714, filed on Sep. 7, 2018, granted, now 10,886,106.
Claims priority of application No. PCT/JP2017/033240 (WO), filed on Sep. 14, 2017.
Prior Publication US 2021/0074515 A1, Mar. 11, 2021
Int. Cl. H01L 21/00 (2006.01); B08B 3/04 (2006.01); B08B 9/00 (2006.01); F04B 49/00 (2006.01); G05D 7/06 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/32449 (2013.01) [B08B 3/04 (2013.01); B08B 9/00 (2013.01); F04B 49/00 (2013.01); G05D 7/0617 (2013.01); H01J 37/32724 (2013.01); H01J 37/32816 (2013.01); H01L 21/67017 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/67253 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/334 (2013.01); H01J 2237/335 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A method of venting a processing chamber to atmosphere, the method comprising:
supplying a heat-transfer gas via a first valve to an evacuating pipe comprising a first portion and a second portion, wherein said first portion and said second portion are connected at a first connection position;
supplying a purging gas via a second valve to the first and second portions of the evacuating pipe via a third pipe that is connected at a second connection position disposed upstream from the first connection position;
venting a processing chamber to atmosphere through a vent pipe via a third valve such that the processing chamber reaches an atmospheric pressure;
after the venting of the processing chamber to atmosphere and prior to a start of evacuation of the processing chamber, continuously supplying the purging gas via the second valve to the first portion of the evacuating pipe and to the second portion of the evacuating pipe to reduce moisture in the first and second portions of the evacuating pipe in order to prevent moisture absorption by a reaction product attached to an inner surface of the first and second portions of the evacuating pipe;
maintaining the continuous supplying of the purging gas to the first portion of the evacuating pipe and to the second portion of the evacuating pipe during a state in which a ceramic plate which forms a top of the processing chamber is removed and returned;
after returning the ceramic plate, performing a vacuum evacuation of the processing chamber at a first rate by closing the second valve to stop the flow of the purging gas, and opening a third valve while a fourth valve is closed; and
after the pressure in the processing chamber reaches a predetermined pressure that is different from the atmospheric pressure, performing a vacuum evacuation of the processing chamber at a second rate that is higher than the first rate by closing the third valve and opening the fourth valve,
wherein the first portion of the evacuating pipe is configured to reduce a pressure in the processing chamber having the atmospheric pressure, and the second portion of the evacuating pipe is configured to evacuate the heat-transfer gas after the heat-transfer gas is supplied to a back surface of a processing target object in order to transfer heat of a stage subjected to temperature adjustment, and
wherein the step of continuously supplying the purging gas to the first and second portions of the evacuating pipe comprises continuously supplying the purging gas to the first connection position, and wherein the first connection position is located downstream of a purging gas supply source.