US 12,266,480 B2
Multilayer ceramic capacitor
Satoshi Yokomizo, Nagaokakyo (JP); Shinobu Chikuma, Nagaokakyo (JP); and Yohei Mukobata, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on May 21, 2024, as Appl. No. 18/670,161.
Application 18/670,161 is a continuation of application No. 17/489,881, filed on Sep. 30, 2021, granted, now 12,009,155.
Claims priority of application No. 2020-169691 (JP), filed on Oct. 7, 2020.
Prior Publication US 2024/0312721 A1, Sep. 19, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/06 (2013.01); H01G 4/2325 (2013.01); H01G 4/248 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A multilayer ceramic capacitor comprising:
a capacitor main body including a multilayer body with a rectangular or substantially rectangular parallelepiped shape and external electrodes each on one of two end surfaces of the multilayer body; and
two interposers on the capacitor main body; wherein
the two interposers respectively include interposer first end surfaces opposed to each other in a length direction, interposer second end surfaces opposed to corresponding ones of the interposer first end surfaces in the length direction, interposer first main surfaces opposed to the capacitor main body, and interposer second main surfaces opposed to corresponding ones of the interposer first main surfaces;
each of the two interposers includes a rectangular or substantially rectangular parallelepiped block portion made of a material including copper or a copper alloy;
each of the two interposers includes a third recess portion between the interposer first end surface and the interposer second main surface; and
each of the two interposers includes a first recess portion on the interposer second end surface, the first recess portion having an arc shape or a substantially arc shape when viewed in a first direction connecting the interposer first main surface and the interposer second main surface.