US 12,266,476 B2
Multilayer ceramic electronic component
Kyo Yeol Lee, Suwon-si (KR); Seung Hun Han, Suwon-si (KR); Sang Wook Lee, Suwon-si (KR); Jung Min Kim, Suwon-si (KR); and Jeong Ryeol Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 26, 2021, as Appl. No. 17/412,731.
Claims priority of application No. 10-2020-0189101 (KR), filed on Dec. 31, 2020.
Prior Publication US 2022/0208457 A1, Jun. 30, 2022
Int. Cl. H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween;
a first external electrode connected to the first internal electrodes;
a second external electrode connected to the second internal electrodes; and
a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode,
wherein the protective layer includes an adhesion assisting layer and a coating layer,
an average thickness of the protective layer is 70 nm or more and less than 400 nm, and
a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and 0.75 or less.