US 12,266,470 B2
MEMS solenoid transformer and manufacturing method thereof
Tiantong Xu, Haidian District (CN); Zhi Tao, Haidian District Beijing (CN); Haiwang Li, Haidian District (CN); Hanxiao Wu, Haidian District (CN); Yanxin Zhai, Haidian District (CN); Kaiyun Zhu, Haidian District (CN); Wenbin Wang, Haidian District (CN); Xiaoda Cao, Haidian District (CN); and Weidong Fang, Haidian District (CN)
Assigned to BEIHANG UNIVERSITY, Beijing (CN)
Appl. No. 17/290,655
Filed by BEIHANG UNIVERSITY, Haidian District (CN)
PCT Filed Jul. 8, 2019, PCT No. PCT/CN2019/095066
§ 371(c)(1), (2) Date Apr. 30, 2021,
PCT Pub. No. WO2020/087973, PCT Pub. Date May 7, 2020.
Claims priority of application No. 201811278308.7 (CN), filed on Oct. 30, 2018; and application No. 201811278321.2 (CN), filed on Oct. 30, 2018.
Prior Publication US 2021/0358688 A1, Nov. 18, 2021
Prior Publication US 2024/0428990 A2, Dec. 26, 2024
Int. Cl. H01F 17/06 (2006.01); H01F 1/16 (2006.01); H01F 3/02 (2006.01); H01F 27/245 (2006.01); H01F 27/26 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01L 49/02 (2006.01)
CPC H01F 41/0233 (2013.01) [H01F 1/16 (2013.01); H01F 3/02 (2013.01); H01F 17/062 (2013.01); H01F 27/245 (2013.01); H01F 27/263 (2013.01); H01F 41/042 (2013.01); H01L 28/10 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A MEMS square loop solenoid transformer, comprising:
a silicon substrate, a soft magnetic core, a first solenoid and a second solenoid;
wherein, the soft magnetic core is wrapped inside the silicon substrate, the silicon substrate is provided with a first spiral channel and a second spiral channel, and two opposite sides of the soft magnetic core respectively pass through a center of the first spiral channel and a center of the second spiral channel, wherein the first solenoid and the second solenoid are respectively disposed in the first spiral channel and the second spiral channel;
wherein the silicon substrate comprises an upper silicon substrate and a lower silicon substrate, the soft magnetic core comprises an upper core and a lower core, and the upper core has a same shape as the lower core;
wherein the upper silicon substrate is provided with a core slot on a lower surface thereof corresponding to a shape of the upper core, and the lower silicon substrate is provided with a core slot on an upper surface thereof corresponding to a shape of the lower core; and
wherein the upper core and the lower core are disposed in the corresponding core slots, respectively, and the lower surface of the upper silicon substrate and the upper surface of the lower silicon substrate are bonded to each other, so that a lower surface of the upper core and an upper surface of the lower core are aligned with each other.