US 12,266,424 B2
Memory circuit and method of operating same
Yi-Ching Liu, Hsinchu (TW); Chia-En Huang, Hsinchu (TW); and Yih Wang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Nov. 28, 2023, as Appl. No. 18/521,476.
Application 17/815,121 is a division of application No. 17/154,514, filed on Jan. 21, 2021, granted, now 11,521,663, issued on Dec. 6, 2022.
Application 18/521,476 is a continuation of application No. 17/815,121, filed on Jul. 26, 2022, granted, now 11,854,663.
Claims priority of provisional application 63/057,069, filed on Jul. 27, 2020.
Prior Publication US 2024/0096386 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G11C 16/10 (2006.01); G11C 8/08 (2006.01); G11C 8/10 (2006.01)
CPC G11C 8/08 (2013.01) [G11C 8/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory circuit, comprising:
a first memory cell on a first layer;
a second memory cell on a second layer different from the first layer;
a first select transistor on a third layer different from the first layer and the second layer;
a first bit line extending in a first direction, and being coupled to the first memory cell and the second memory cell;
a first source line extending in the first direction, being coupled to the first memory cell, the second memory cell and the first select transistor, and being separated from the first bit line in a second direction different from the first direction; and
a second source line extending in the first direction, and being coupled to the first select transistor.