US 12,266,411 B2
Apparatus with circuit-locating mechanism
Itamar Lavy, Rockville, MD (US); Chunhao Wang, Chantilly, VA (US); and Wesley B. Butler, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 22, 2024, as Appl. No. 18/584,928.
Application 18/584,928 is a continuation of application No. 18/059,335, filed on Nov. 28, 2022, granted, now 11,967,390.
Application 18/059,335 is a continuation of application No. 16/536,470, filed on Aug. 9, 2019, granted, now 11,551,777, issued on Jan. 10, 2023.
Prior Publication US 2024/0265990 A1, Aug. 8, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G11C 29/44 (2006.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01); G11C 29/04 (2006.01)
CPC G11C 29/44 (2013.01) [H01L 21/67242 (2013.01); H01L 21/67259 (2013.01); H01L 21/67282 (2013.01); H01L 21/67294 (2013.01); H01L 23/544 (2013.01); G11C 2029/0403 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a substrate;
circuit components disposed on the substrate;
a planar mesh over the circuit components and including one or more section labels configured to provide locational reference to the circuit components; and
a protective layer over the planar mesh.