US 12,265,874 B2
RFID devices including embossed or other elements
Ian J. Forster, Chelmsford (GB)
Assigned to Avery Dennison Retail Information Services LLC, Mentor, OH (US)
Filed by Avery Dennison Retail Information Services, LLC, Mentor, OH (US)
Filed on Nov. 27, 2020, as Appl. No. 17/105,930.
Claims priority of provisional application 62/940,308, filed on Nov. 26, 2019.
Prior Publication US 2021/0158125 A1, May 27, 2021
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07773 (2013.01) 17 Claims
OG exemplary drawing
 
1. An RFID device comprising:
an RFID assembly comprising a foil RFID antenna and an RFID chip electrically coupled to the foil RFID antenna, the RFID assembly having a first side and a second side; and
a first layer comprising a first visual element and having a first side and a second side, the first side of the first layer contacting the first side of the RFID assembly, wherein the first layer comprises a plastic;
a second layer supporting the RFID assembly having a first side and a second side, the first side of the second layer contacting at least one of the first visual element and the RFID assembly; and
a modifying element electrically coupled to the RFID chip and configured to modify the RFID device to display a visible indicia of the first visual element, wherein the modifying element comprises a piezoelectric element.