US 12,265,873 B2
RFID label and adherend
Haruhiko Nitta, Minato-ku (JP)
Assigned to SATO HOLDINGS KABUSHIKI KAISHA, Tokyo (JP)
Appl. No. 18/269,530
Filed by SATO HOLDINGS KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Nov. 30, 2021, PCT No. PCT/JP2021/043962
§ 371(c)(1), (2) Date Jun. 23, 2023,
PCT Pub. No. WO2022/138019, PCT Pub. Date Jun. 30, 2022.
Claims priority of application No. 2020-215297 (JP), filed on Dec. 24, 2020.
Prior Publication US 2024/0070430 A1, Feb. 29, 2024
Int. Cl. G06K 19/07 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/0776 (2013.01) [G06K 19/0723 (2013.01); G06K 19/07722 (2013.01); G06K 19/07786 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An RFID label, comprising:
an RFID inlay including an inlay substrate, an RFID antenna formed on the inlay substrate, and an IC chip connected to the RFID antenna;
a hot melt-based adhesive layer laminated on a surface of the RFID inlay on which the RFID antenna and the IC chip are formed;
a first thermoplastic resin sheet; and
an adherend adhesive layer configured to be attached to an adherend, wherein
the RFID inlay, the hot melt-based adhesive layer, the first thermoplastic resin sheet, and the adherend adhesive layer are laminated in this order.