US 12,265,488 B2
Apparatus and method for die-to-die (D2D) interconnects
Wangyong Im, Suwon-si (KR); Byoungkon Jo, Suwon-si (KR); Gyesik Oh, Suwon-si (KR); Duksung Kim, Suwon-si (KR); and Jangseok Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Oct. 31, 2023, as Appl. No. 18/385,590.
Claims priority of application No. 10-2023-0006990 (KR), filed on Jan. 17, 2023.
Prior Publication US 2024/0241840 A1, Jul. 18, 2024
Int. Cl. G06F 13/38 (2006.01); G06F 13/16 (2006.01); G06F 13/40 (2006.01)
CPC G06F 13/1668 (2013.01) [G06F 13/4068 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first die connected to a second die through a die-to-die (D2D) interface, wherein:
the first die includes a first interconnect configured to provide first lanes communicating with the second die to the D2D interface,
the first interconnect includes a first logic circuit configured to indicate a correlation between a number of chiplet dies connected to the first lanes and connected signal pins from among a plurality of signal pins of the connected chiplet dies,
the second die includes the number of connected chiplet dies each including a second interconnect configured to provide second lanes to the D2D interface from each of the connected chiplet dies,
the second interconnect includes a second logic circuit configured to indicate the correlation, and
the second lanes are configured to be set according to a number of the connected signal pins of the connected chiplet dies.