US 12,265,482 B2
System and method for providing compression attached memory module offset stacking
Arnold Thomas Schnell, Hutto, TX (US); and Joseph Daniel Mallory, Cedar Park, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by DELL PRODUCTS L.P., Round Rock, TX (US)
Filed on Jul. 18, 2022, as Appl. No. 17/866,737.
Application 17/866,737 is a continuation in part of application No. 16/935,852, filed on Jul. 22, 2020, granted, now 11,394,141.
Prior Publication US 2022/0350753 A1, Nov. 3, 2022
Int. Cl. G06F 13/16 (2006.01); G06F 12/06 (2006.01)
CPC G06F 13/16 (2013.01) [G06F 12/0646 (2013.01); G06F 2213/16 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An information handling system, comprising:
a printed circuit board (PCB);
a first z-axis compression connector coupled to receive a first memory channel and a second memory channel from the PCB;
a first compression attached memory module (CAMM) coupled to receive the first memory channel and the second memory channel from the first compression connector, and configured to provide memory transaction on only the first memory channel;
a second z-axis compression connector coupled to receive the second memory channel from the first CAMM; and
a second CAMM coupled to receive the second memory channel from the second compression connector.